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ASML's Next Big Chipmaking Cycle Has a Timeline—Intel, Samsung and TSMC Set It | WAPE

Newsbenzinga

ASML's Next Big Chipmaking Cycle Has a Timeline—Intel, Samsung and TSMC Set It

Oct 14, 2026, 12:22 ET · Published

Article summary

Intel has exposed 1 million wafers using ASML High-NA EUV. Samsung targets 2028 production, while TSMC aims for 2030.

An excerpt from the original article.

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