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ASML's Next Big Chipmaking Cycle Has a Timeline—Intel, Samsung and TSMC Set It
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기사 요약
Intel has exposed 1 million wafers using ASML High-NA EUV. Samsung targets 2028 production, while TSMC aims for 2030.
기사 원문에서 발췌했어요.Intel has exposed 1 million wafers using ASML High-NA EUV. Samsung targets 2028 production, while TSMC aims for 2030.
기사 원문에서 발췌했어요.
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