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GlobalFoundries Lands $2 Billion TSMC Deal to Expand US AI Chip Packaging | WAPE

Newsbenzinga

GlobalFoundries Lands $2 Billion TSMC Deal to Expand US AI Chip Packaging

Oct 8, 2026, 12:43 ET · Published

Article summary

GlobalFoundries, TSMC deal brings $2 billion to U.S. advanced packaging capacity for AI and high-performance computing.

An excerpt from the original article.

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